Browse Prior Art Database

Cooling of Single Chip Module or Multi Chip Module with Surface Mount Array Process

IP.com Disclosure Number: IPCOM000105266D
Original Publication Date: 1993-Jul-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Gagnage, A: AUTHOR

Abstract

Disclosed is cooling of single chip module (SCM) or multi chip module (MCM) using surface mount array process.

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Cooling of Single Chip Module or Multi Chip Module with Surface

Mount

Array

Process

      Disclosed is cooling of single chip module (SCM) or multi chip
module (MCM) using surface mount array process.

      A module is soldered on a card thru pins (Surface Mount Array
process).

      A flow of cold air is forced between module and card thru pins
as shown on the figure.

      Thermal conductivity of pins ensure a good cooling of substrate
on which pins are soldered.

      Substrate supports chip(s) to be cooled down.

      Chips to be located card side (better cooling) or opposite
side.

      Dimensions and material of pins are depending upon the quantity
of calories to be evacuated (copper alloys have a good thermal
coeff.).  Pins being an "heat exchanger", no heatsink is necessary.

      With this technique, no heatsink, the card assembly will need a
smaller volume but a tunnel will be necessary to drive cold air to
the card cooling hole.

      Example :

      Cooling surface for 208 pins : With .8mm dia pins (our example)
and cooling length of 8.7mm, cooling surface is 9 square cm.  With
1mm dia pins and 9mm of free length, surface is 14.7 sq.cm.  With
.8mm dia pins and 6mm of free length, surface is 6.3 sq.cm

      Number of pins will be requested by the number of I/O's needed
on the card.