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Browse Prior Art Database

Solder Ball Connect Placement Nest

IP.com Disclosure Number: IPCOM000105356D
Original Publication Date: 1993-Jul-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Best, DP: AUTHOR [+5]

Abstract

A centering nest for multiple size land grid array modules to be used on an automated pick and place tools for more accurate placement of the modules onto the printed circuit board.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Solder Ball Connect Placement Nest

      A centering nest for multiple size land grid array modules to
be used on an automated pick and place tools for more accurate
placement of the modules onto the printed circuit board.

      By making each size nest in the overall nest get successively
smaller and recessed from the last size nest, the nest will both
accept more than one size of module and also fit the modules in such
a way that if the modules are not centered the modules will be
visibly tilted in the nest so the operator can see that they are in
wrong.  Also, in auto mode the placement equipment will not pick up
the parts if they are tilted.  As the need arises the nest can be
modified to fit more sizes besides and still have the same features.

      In usage the module will be picked out of a shipping tray built
to JEDEC standards, placed in the centering nest to precisely define
the center and X, Y location of the module.  There are locating ribs
on each level to center the part on the leads.  Then using the
locating ribs in the nest as the positional reference, place the
module onto a printed circuit board.