Browse Prior Art Database

Combined Heating/Cooling Plate for Lithographic Processes

IP.com Disclosure Number: IPCOM000105364D
Original Publication Date: 1993-Jul-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Grassmann, A: AUTHOR

Abstract

Described is a heating/cooling plate for carrying wafers in lithographic processes, which is assembled in the form of a module such that its direct support is either cooled with a cooling medium or heated by contacting a massive heating plate.

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Combined Heating/Cooling Plate for Lithographic Processes

      Described is a heating/cooling plate for carrying wafers in
lithographic processes, which is assembled in the form of a module
such that its direct support is either cooled with a cooling medium
or heated by contacting a massive heating plate.

      A support plate of aluminum has through holes for pins by which
a wafer positioned thereon is lifted off.  The support plate also has
ducts and connectors for the cooling medium.

      The combined heating/cooling plate is designed as follows (Fig.
1):  During baking and cooling (Fig. 2), the wafer rests on the thin
support plate which is made of a material (such as Al) having a high
thermal conductivity but a low thermal capacity.  For heating, the
plate is brought into thermal contact with an underlying plate acting
as a heating storage, whereas for cooling, it is moved upwards and
thus thermally decoupled.  By means of the cooling medium (water),
the plate is cooled to the desired temperature within a short time.
After cooling, the wafer is lifted off by means of the pins to be
transported by a handling system.  At the same time, the cooling
water is removed, for example, by expulsion, using compressed-air.
Thermal contact to the heat storage is re-established by lowering the
plate which is then prepared for the next heating step.

      A large massive plate of material (such as Cu) of good thermal
conductivity serves as a heat storage wit...