Browse Prior Art Database

Controlled Air-Flow Distribution for Cooling of Electronic Components in Computer Systems

IP.com Disclosure Number: IPCOM000105368D
Original Publication Date: 1993-Jul-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 69K

Publishing Venue

IBM

Related People

Miller, SJ: AUTHOR [+5]

Abstract

Disclosed is a centralized air distribution plenum for cooling a system of electronic components packaged in an enclosure such as a computer frame. The design of the plenum is such that it allows the system being cooled to meet requirements of 100% availability and concurrent maintenance, while at the same time providing higher reliability, lower cost, and quieter operation compared to conventional cooling approaches. The plenum contains a relatively small number of air moving devices (AMDs), which produce the required air flow.

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This is the abbreviated version, containing approximately 52% of the total text.

Controlled Air-Flow Distribution for Cooling of Electronic Components in Computer Systems

      Disclosed is a centralized air distribution plenum for cooling
a system of electronic components packaged in an enclosure such as a
computer frame.  The design of the plenum is such that it allows the
system being cooled to meet requirements of 100% availability and
concurrent maintenance, while at the same time providing higher
reliability, lower cost, and quieter operation compared to
conventional cooling approaches.  The plenum contains a relatively
small number of air moving devices (AMDs), which produce the required
air flow.

      Through the use of air openings having controllable and
relatively high flow resistances, the plenum provides a stable source
of uniform air flow to the electronic components located in the
frame.  The plenum pressures remain relatively constant and
independent of the system air loads.  There are no strong flow
gradients from any particular AMD to any particular air opening.
Hence, the air flow through a particular opening will not be strongly
affected by the loss of an AMD in its vicinity, and uniform air flow
can be maintained (100% availability).  One or more of the AMDs or
electronic modules being cooled can be removed and replaced without
creating an imbalance in the air flow (concurrent maintenance).
Whereas a conventional scheme for cooling a computer frame employs
many individual AMDs distributed amongst the various electronic
modules, the plenum concept...