Browse Prior Art Database

Composite Elastomeric Pressure Connector

IP.com Disclosure Number: IPCOM000105377D
Original Publication Date: 1993-Jul-01
Included in the Prior Art Database: 2005-Mar-19
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Oh, S: AUTHOR [+2]

Abstract

Disclosed is a thermal-expansion-controlled, interposer-type connector structure and its fabrication steps.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 83% of the total text.

Composite Elastomeric Pressure Connector

      Disclosed is a thermal-expansion-controlled, interposer-type
connector structure and its fabrication steps.

      The connector will provide reliable connection between the I/O
pads of a high-density module and a circuit board without the need
for plugging or soldering.  The major advantages of the present
connector are tailored thermal expansion and physical stability.  One
other advantage is the ability to reduce electrical noise by
grounding the metal core.

      As shown in the figure, the connector is made out of a core
metal plate, insulation coating, elastomer body and pins.  The core
metal can be selected depending on thermal and mechanical
requirements.  For low thermal expansion, molybdenum or
copper-invar-copper (CIC) plate may be used.  For high thermal
conduction and greater ease of fabrication, copper or aluminum can be
chosen.

      Through-holes on the core metal plate can be made by drilling,
stamping, laser ablation, or chemical etching.  An insulation coat on
the core metal plate can be fabricated by evaporating polymer or by
other processes such as spinning of dielectrics or chemical treatment
of the metal core.  After casting with an appropriate elastomer,
smaller holes are made through the elastomer-filled holes for
insertion of pins.  For maximum wiping action, oblique holes are
preferred.

      The conduction pins can be made out of a corrosion-resistant
alloy or plated me...