Browse Prior Art Database

Surface Reaction of Polyamic Acid/Polyaniline Application for Metallization

IP.com Disclosure Number: IPCOM000105570D
Original Publication Date: 1993-Aug-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 68K

Publishing Venue

IBM

Related People

Angelopoulos, M: AUTHOR [+3]

Abstract

Disclosed is a process in which a conducting surface layer is fabricated by reacting a surface modified polyimide with polyaniline. Enhanced adhesion is expected as a result of the intermixed, interfacial layer which is formed due to the chemical interaction between the two polymers. The surface modified polyimide/polyaniline interaction can be used for metallization applications.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Surface Reaction of Polyamic Acid/Polyaniline Application for Metallization

      Disclosed is a process in which a conducting surface layer is
fabricated by reacting a surface modified polyimide with polyaniline.
Enhanced adhesion is expected as a result of the intermixed,
interfacial layer which is formed due to the chemical interaction
between the two polymers.  The surface modified polyimide/polyaniline
interaction can be used for metallization applications.

      Polyimides are widely used as interlevel dielectrics for
multilevel interconnections in microchips and electronic packaging
structures because of their excellent mechanical and physical
properties.  The adhesion, however, of polymers and/or metal to
polyimides is generally weak.  To circumvent this problem and at the
same time retain the desired bulk properties of polyimides, surface
modification techniques have been commonly used.  One such
modification scheme involves reacting the imide ring of the polyimide
with a base to form a polyamate salt which is subsequently protonated
to yield the amic acid [1]  (Figure: step 1).  Depending on the
reaction conditions, this modification can be limited to the film
surface (&approx.  100-200 A  modification depth).  Herein, the
surface generated polyamic acid groups are found to react with
polyaniline forming a surface conducting layer.

      Polyaniline is one of the most widely studied conducting
polymer.  It is a solution processable material which undergoes an
insulator to metal transition upon doping with protonic acids.  In
the present case, polyaniline is spin-applied from an
N-methylpyrrolidinone (N...