Browse Prior Art Database

Universal Option Card Heatsink

IP.com Disclosure Number: IPCOM000105586D
Original Publication Date: 1993-Aug-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 75K

Publishing Venue

IBM

Related People

McBride, RA: AUTHOR [+2]

Abstract

Disclosed is a heatsink unit configured for clamping in place over the component side of a printed circuit card, in which mechanically conformable, thermally conductive materials are supported within a frame extending between a finned metal plate and the circuit card.

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This is the abbreviated version, containing approximately 58% of the total text.

Universal Option Card Heatsink

      Disclosed is a heatsink unit configured for clamping in place
over the component side of a printed circuit card, in which
mechanically conformable, thermally conductive materials are
supported within a frame extending between a finned metal plate and
the circuit card.

      As shown in Fig. 1, a heatsink unit 1 consists of a shallow
rectangular frame 2, having the general shape of the circuit card 3
to which it is applied, mounted on a flat side of a finned metal
plate 4.  Frame 2 is filled with a thermally conductive paste 5,
which may consist of a highly conformable, thermally conductive
elastomer, it stretched across an open side of frame 2, being held
along four edges by grooves 7 in frame 2.  This layer 6 may be
formed, for example, using the material sold as CHO-THERM* T274 by
Chomerics, Inc., Hudson, NJ.  A number of relief openings 8 are
provided along the edges of frame 2 adjacent to metal plate 4.  Frame
2 also includes grooved tracks 9, in which clamps 10 may be slid
along adjacent edges of circuit card 3.  Each clamp 10 includes a
sliding portion 11, operating in a track 9, and a pivoting portion
12, pivotally mounted at a pivot 13.

      The assembly of heatsink unit 1 to circuit card 3 is begun by
pressing unit 1 in place over the card, with pivoting portions 12
rotated outward in the direction of arrows 14.  Various components 15
of card 3 extend into frame 2, displacing a portion of thermally
conductiv...