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Tape Transport Mechanism for Semiconductor Wafer Publication

IP.com Disclosure Number: IPCOM000105689D
Original Publication Date: 1993-Aug-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 3 page(s) / 106K

Publishing Venue

IBM

Related People

Chan, SA: AUTHOR [+6]

Abstract

Described is a hardware implementation of a tape transport mechanism (TTM) for transporting silicon wafer laminate material through a thin film application machine, as used in the fabrication of semiconductor wafers. The design involves a four station application mechanism that maintains all required registration requirements.

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This is the abbreviated version, containing approximately 52% of the total text.

Tape Transport Mechanism for Semiconductor Wafer Publication

      Described is a hardware implementation of a tape transport
mechanism (TTM) for transporting silicon wafer laminate material
through a thin film application machine, as used in the fabrication
of semiconductor wafers.  The design involves a four station
application mechanism that maintains all required registration
requirements.

      Typically, the photo resist thin film material used in the
fabrication of silicon wafers is of a layered material of uniform
thickness purchased in roll form.  A punching mechanism is used to
punch a predetermined size blank of thin film for transfer onto a
long continuous tape.  The tape moves the blank from punch to punch
through peel, lamination and separator stations sequentially.  Since
the tape is one long continuous strip, difficulty can be experienced
in maintaining proper registration between the blank and the wafer.
The concept described herein reduces the tape length and eliminates
registration problems and can be used advantageously in any process
involving thin film handling, manipulation or application.

      Fig. 1 shows an isometric view, Fig. 2 shows the front view and
Fig. 3 shows the top view of the TTM.  In actual operation, purchased
tape roll 10 (Fig. 1) is loaded onto spindle 11 and run along tape
path 12 (Fig. 2) to thread onto spindle 13 (Fig. 1) with the glue
side pointed downward.  Spindles 11 and 13 are coupled directly to
synchronous motors 14 and 15 running in opposition with
torque-adjustable clutch mechanism 16 (Fig. 3) on the supply side and
an encoder (not shown) on the take-up side.  Since the tape does not
advance during a process cycle, tape tension variation due to the
diameter changes is allowable requiring no idler arm.  Vacuum
chambered brake assembly 17 is used to keep the tape in place during
a cycle.  Supply motor 14 is run counterclockwise continuously to
maintain proper tape tension.  A brake, on brake assembly 17, is
applied on the non-sticky side of the tape so that problems w...