Original Publication Date: 1993-Sep-01
Included in the Prior Art Database: 2005-Mar-20
Proposed is a tool allowing mechanical cleavage of semiconductor chips, in particular laser chips.
Proposed is a
tool allowing mechanical cleavage of
semiconductor chips, in particular laser chips.
conventional laser bar 1 is illustrated in Fig. 1. Four
laser diodes with ridge waveguide 2 are integrated on bar 1. The
front and back facets - being parallel to each other - of these laser
diodes were cleaved in a previous step. These two facets define the
cavity of the lasers, the front facet 3 serving as a light-emitting
facet. Prior to separating neighboring laser diodes using the
present chip cleaver, the laser bar 1 has to be scribed. The scribe
marks 4 define the position of the cleavage being carried out.
Typical dimensions are: L = 750 mu m, H = 150 mu m, and W = 300 mu
chip cleaver 13 is shown in Fig. 2. To
cleaving of chips having small aspect ratios, e.g., 2:1 (W:H), the
bars 1 to be cleaved are sandwiched between an upper and a lower
stretchable foil 9 and 10, respectively. By adjustment of the
tension in foils 9 and 10, the width W of the chips to be cleaved is
artifically elongated. The tension of the foils 9 and 10 holds the
chips in place and prevents overturns and tilting. Foils 9 and 10
are fixed in a support system consisting of two mounting clamps 11
and 12. The tension of the foils can be adjusted by moving one of
the clamps, e.g., clamp 12, with respect to the other clamp. Before
fixing the foils in the supported system, a bar 1 to be cleaved is
placed on top of...