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Special Thermal Conductive Interposers

IP.com Disclosure Number: IPCOM000105894D
Original Publication Date: 1993-Sep-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Hidaka, K: AUTHOR [+2]

Abstract

Described are special thermal conduction interposers (bellows and spring) which are an indirect cooling method for cards and modules packaged in a computer system. The special thermal conduction bellows and spring can conduct the heat out of cards and modules to a heat sink, correspond with any gap between the modules and the heat sink, and regulate the pressure on the modules freely.

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Special Thermal Conductive Interposers

      Described are special thermal conduction interposers (bellows
and spring) which are an indirect cooling method for cards and
modules packaged in a computer system.  The special thermal
conduction bellows and spring can conduct the heat out of cards and
modules to a heat sink, correspond with any gap between the modules
and the heat sink, and regulate the pressure on the modules freely.

      Fig. 1 shows the sample of special thermal conduction Spring.
The special thermal conduction spring is attached between a module
and a heat sink.  The special thermal conduction spring is composed
of several copper spring sandwiched by two copper sheets.  Fig. 2
shows the sample of special thermal conduction Bellows.  The special
thermal conduction bellows is attached between a module and a heat
sink.  The special conduction bellows is filled up high conductive
thermal grease.  The heat generated at the module translates through
the special thermal conduction spring or bellows and radiates from
the heat sink.

      The special thermal conduction bellows and spring are
applicable to small package mounted modules like as Fig. 3.