Browse Prior Art Database

Soft Wafer Holder

IP.com Disclosure Number: IPCOM000105916D
Original Publication Date: 1993-Sep-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Chaussard, J: AUTHOR [+3]

Abstract

The present disclosure is related to a system which allows frame mount ing of any type of wafers for the dicing/picking process step.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Soft Wafer Holder

      The present disclosure is related to a system which allows
frame mount ing of any type of wafers for the dicing/picking process
step.

      During this step, the conventional non-contact chuck is not
able to handle ground or C4 pads at tape apply on the wafer backside
of wafer frame mounting process.

      Thus, the use of a specific soft foam interface glued on the
chuck, is suggested to achieve soft holding and accurate positionning
on a single chuck compatible for all types of finished wafer (ground
or not, wire bond or C4 pads) at ambiant.

      On the taping station, use a specific soft front side wafer
holder which keep the same alignment accuracy than the previous wafer
alignment station.  This chuck handle the wafer under the tape apply
station.