Browse Prior Art Database

Method to Support Inner Leads of Semiconductor Package

IP.com Disclosure Number: IPCOM000105930D
Original Publication Date: 1993-Sep-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Kiyono, S: AUTHOR

Abstract

Described is a method to support inner leads of semiconductor packages applying "Area-Wire" Technology, which has a construction of leads on chip surface using double-sided adhesive tape. This method is effective for rnarrow width leads in thin and high density packages.

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Method to Support Inner Leads of Semiconductor Package

      Described is a method to support inner leads of semiconductor
packages applying "Area-Wire" Technology, which has a construction of
leads on chip surface using double-sided adhesive tape.  This method
is effective for rnarrow width leads in thin and high density
packages.

      The increase of tape fillet area improves the adhesive strength
to hold the lead and tape.  This provides a stable wire bonding
quality and prevens the plastic delamination.  Applying slits or
anchor holes is a solution for wide width leads, but is difficult for
narrow width leads that has no enough space on its surface as shown
in Fig. 1.

      To avoid the problem, in the proposed scheme, reducing the lead
thickness several on areas by etching, placing the lead on the tape,
and covering the reduced areas by tape adhesive are performed as
shown in Fig. 2.  Then the covered areas become a z-axis anchor to
hold the narrow width leads on the tape.

      The proposed thickness reduction area should be around the
second wire bonding point to hold the lead movement securely, and on
the weak point where tape and lead delamination is concerned.  And as
an additional improvement, the remained area above the adhesive also
becomes a z-axis anchor for the plastic and lead.

      This method is applicable for all "Area-Wire" Technology
packages, which use narrow width inner leads to realize thin bodies
or high density outer...