Browse Prior Art Database

Bump Tape Connector

IP.com Disclosure Number: IPCOM000106107D
Original Publication Date: 1993-Sep-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 73K

Publishing Venue

IBM

Related People

Nishida, K: AUTHOR [+2]

Abstract

Disclosed is a construction of device (I) named "Bump Tape Connector (BTC)" and its application (II) as a part of high density SMT (Surface Mount Technology) connector system on PCB (Printed Circuit Board). BTC consists of dielectric layer, contact bumps (on the front side) and bonding pads (on the back side). These bonding pads are bonded with solder or electrically conductive adhesive to the PCB-pads. Bumps are accommodated as the contact bumps for connector system on PCB.

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Bump Tape Connector

      Disclosed is a construction of device (I) named "Bump Tape
Connector (BTC)" and its application (II) as a part of high density
SMT (Surface Mount Technology) connector system on PCB (Printed
Circuit Board).  BTC consists of dielectric layer, contact bumps (on
the front side) and bonding pads (on the back side).  These bonding
pads are bonded with solder or electrically conductive adhesive to
the PCB-pads.  Bumps are accommodated as the contact bumps for
connector system on PCB.

      Fig. 1 shows a typical construction of this device.
Contact-bumps (2), which are covered with contact metal(such as gold
or palladium), are located on the front side surface of the
dielectric(1)(such as polyimide, polyester or epoxy/grass).
Bonding-pads(3) are located on the back side surface of the
dielectric.  Contact-bump and Bonding-pad are electrically connected.
Each point is electrically isolated by the dielectric.  Dielectric
layer has Alignment-holes(4) in order to allow the accurate alignment
of BTC assembly to the PCB.

      Fig. 2 shows a typical application for connecter system
connecting between Flex circuit (such as TAB tape) and PCB.  Bonding
pads of BTC are soldered or electrically bonded to the PCB-pads.
Solder or bonding adhesive is isolated by the dielectric layer(1) so
that the influences to the contact metal (2') such as splashes by the
bonding material are avoided.  Flex is accurately aligned to the BTC
with alignment holes o...