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Self-Dimensioning Bonding Material

IP.com Disclosure Number: IPCOM000106146D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Rudin, H: AUTHOR

Abstract

For many bonding (or glueing) fluids, the thickness of the bonding layer is critical for a good bond between the two surfaces to be bonded: too thin or too thick a layer results in a weak bond. The thickness of the bonding layer is regulated by the amound of pressure used to hold the two surfaces together during the curing period. It is difficult to achieve the optimum, but critical, holding pressure.

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Self-Dimensioning Bonding Material

      For many bonding (or glueing) fluids, the thickness of the
bonding layer is critical for a good bond between the two surfaces to
be bonded: too thin or too thick a layer results in a weak bond.  The
thickness of the bonding layer is regulated by the amound of pressure
used to hold the two surfaces together during the curing period.  It
is difficult to achieve the optimum, but critical, holding pressure.

      The solution to this problem consists in adding particles of a
solid material and, preferably, of homogeneous size to the bonding
fluid.  These particles can be thought of as being spherical, with a
diameter such that, when the two surfaces are pressed together, the
ideal bonding layer thickness is maintained.  Thus, above some
minimum value, bonding is relatively insensitive to the pressure
applied.

      The physical and chemical properties, e.g., dielectric
constant, hardness, solubility of the particles must be chosen
depending on the application at hand.