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Method of Fabrication of Build-up Type Printed Circuit Board

IP.com Disclosure Number: IPCOM000106155D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Murakami, T: AUTHOR [+3]

Abstract

Disclosed is a method of fabrication of build-up type printed circuit board, for example, Surface Laminated Circuit (SLC). This method can increase manufacturing capacity by processing build-up process for two single sides of the composite of circuit boards fastened together at the same time.

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Method of Fabrication of Build-up Type Printed Circuit Board

       Disclosed is a method of fabrication of build-up type printed
circuit board, for example, Surface Laminated Circuit (SLC).  This
method can increase manufacturing capacity by processing build-up
process for two single sides of the composite of circuit boards
fastened together at the same time.

 At step 1 in Figure, the composite of two circuit boards is made by
laminating two boards by using a foil of Cu/Al/Cu structure or using
adhesive between the boards.

 At step 2, process for building-up circuit/insulator on both sides
of the composite is done.

 At step 3, the composite is separated into to two circuit boards by
peeling apart the joint at the center of the composite.  And then, a
via hole is drilled into the circuit board.

 At step 4, plating and circuitizing of the external layer are done
finally.