Browse Prior Art Database

Oscillator Module De-Capsulation Tool

IP.com Disclosure Number: IPCOM000106217D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 146K

Publishing Venue

IBM

Related People

Cain, JF: AUTHOR [+2]

Abstract

An oscillator module is constructed to conform to a 14 Dual In-line Package (DIP), but uses only four pins (#1, 7, 8 and 14) for inter-connection with a carrier. A mechanical method of separating the top (or lid) from the substrate without disturbing the circuit or components was accomplished with a device that shears a weldment between the base and the can. This provides a "clean", quick deprocessing method that minimizes any disturbance to the original function and construction.

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Oscillator Module De-Capsulation Tool

      An oscillator module is constructed to conform to a 14 Dual
In-line Package (DIP), but uses only four pins (#1, 7, 8 and 14) for
inter-connection with a carrier.  A mechanical method of separating
the top (or lid) from the substrate without disturbing the circuit or
components was accomplished with a device that shears a weldment
between the base and the can.  This provides a "clean", quick
deprocessing method that minimizes any disturbance to the original
function and construction.

      A photo of the disassembled tool is shown in Fig. 1.  An
oscillator module is placed on a block containing four clearance
holes for the pins so as not to damage them.  The top of the tool is
guided with dow pins to facilitate accurate alignment of the shearing
member with the sample to be opened.  The assembled tool is placed in
an arbor press and actuated to closure.  Spacers that act as a stop
are located between the top and bottom sections of the tool.  The
hermetic bead joining the can to the substrate is sheared.  The tool
is disassembled and the module is removed from the cavity (with
spring action behind the can).  The top of the module is removed from
the   portion of the unit.  Fig. 2 shows the module before and after
shearing.  This top is usually lifted, or pried with a fine surgical
razor, to expose the component and circuit being substrate.
Evaluation is therefore accomplished on a sample that has not been
expos...