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Browse Prior Art Database

Flip Chip Burn-in Socket

IP.com Disclosure Number: IPCOM000106239D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Tsukada, Y: AUTHOR

Abstract

Disclosed is a burn-in socket device which acts to hold a semiconductor chip. It also provides electrical connection between solder bumps of the chip and terminal pads of the socket without making solid joint during chip burn-in process.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Flip Chip Burn-in Socket

      Disclosed is a burn-in socket device which acts to hold a
semiconductor chip.  It also provides electrical connection between
solder bumps of the chip and terminal pads of the socket without
making solid joint during chip burn-in process.

      This device includes a substrate (3) on which terminal pads (4)
corresponding in position to the solder bumps (2) of the chip (1) are
formed.  A chip alignment plate (5) with an opening for receiving the
chip is provided  on the substrate (3).  When the chip (1) is placed
in the opening, the solder bumps (2) are brought into alignment with
the terminal pads (3).

      After placing the chip (1) in the opening of the plate (5), a
cap (6) with a movable pressure plate (7) biased by a spring (8) is
attached to a holder (9).  The plate (7) contacts the chip (1) and
applies a necessary pressure to the back side of the chip (1) under
the action  of the spring (8) so that desired electrical contact
between the bumps (2) and pads (4) are assured during the chip
burn-in process.  Planarity differences of the bumps (2) and pads (4)
are cancelled by plastic deformation of the bump solder.  After
burn-in test, the cap (6) is removed to take out the chip (1) from
the socket.