Browse Prior Art Database

Polymer Resistor Formation in Photo Via

IP.com Disclosure Number: IPCOM000106262D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Okabe, S: AUTHOR

Abstract

Disclosed is a structure to embed the polymer resistor in photo via which connects lines between layers in SLC (Surface Laminar Carrier) manufacturing process.

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Polymer Resistor Formation in Photo Via

      Disclosed is a structure to embed the polymer resistor in photo
via which connects lines between layers in SLC (Surface Laminar
Carrier) manufacturing process.

      In cases connecting two circuits which sandwich an insulator
layer in SLC construction as a following picture, photo vias are
formed after coating an insulator layer on bottom circuit.  This
method is to build polymer resistors formed in the photo vias in the
SLC process.

      The process flow is as follows;

1.    Bottom circuit formation
2.    Insulator layer coating
3.    Photo via formation
4.    Ag paste dispensation into photo via and curing
5.    Polymer resist paste dispensation into photo via and curing
6.    Ag paste dispensation into photo via and curing
7.    Insulator layer curing
8.    Surface leveling and treatment
9.    Top circuit formation

The merits of this method are as follows:

1.    It is possible to expand SMC (Surface Mount Component)
    mountable area on PCB(Printed Circuit Board).
2.    It is possible to control the resistivity of polymer resistor
    by adjusting design sizes of the photo vias.