Browse Prior Art Database

High Reliable Soldering Pad

IP.com Disclosure Number: IPCOM000106272D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Yamanaka, K: AUTHOR

Abstract

Disclosed is a structure of soldering pad on the PCB (Printed Circuit Board) for Surface Mount Type components in order to get higher reliability by making conductor of the pad thicker.

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This is the abbreviated version, containing approximately 100% of the total text.

High Reliable Soldering Pad

      Disclosed is a structure of soldering pad on the PCB (Printed
Circuit Board) for Surface Mount Type components in order to get
higher reliability by making conductor of the pad thicker.

      The Figure shows the forming process of the soldering pad.
Photo sensitive material is applied on the signal layer which has the
patterns to be soldering pads.  When forming the insulation layer by
photo process, openings are made on this pattern.  After this
process, Copper is plated and a circuit is patterned in a etching
process.  The soldering pads become to have thicker Copper thickness
because these pads is made of the first Copper in the signal layer
and the plated Copper.

      Thicker Copper of the pad assures high reliability of the
connection after rework/repair of this connection such as removing a
component and re-soldering other component.  This pad becomes more
effective for a larger component rework/repair.