Browse Prior Art Database

Electronic Package Using Multiple Flex Strips for Connections

IP.com Disclosure Number: IPCOM000106285D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 86K

Publishing Venue

IBM

Related People

Lanzetta, AP: AUTHOR [+2]

Abstract

Disclosed is a scheme of using multiple flex strips for connections in multi-chip and single-chip packages. Fig. 1 is the cross-sectional view of a multi-chip module with multiple strips soldered orthogonally on the substrate. The substrate 11 is adhered to the inner surface of the top piece 23 of an enclosure. The strips 13 are placed through the slots in the bottom piece 24 of the enclosure. The top piece 23 is made of thermally conductive materials such as aluminum and the bottom piece 24 is made of electrically insulating materials such as polymers or aluminum coated with insulating materials. The two pieces are then joined together to fo an enclosure for the module. Some reworkable adhesives are used to seal the gaps left in the slots in the bottom piece 24.

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Electronic Package Using Multiple Flex Strips for Connections

      Disclosed is a scheme of using multiple flex strips for
connections in multi-chip and single-chip packages.  Fig. 1 is the
cross-sectional view of a multi-chip module with multiple strips
soldered orthogonally on the substrate.  The substrate 11 is adhered
to the inner surface of the top piece 23 of an enclosure.  The strips
13 are placed through the slots in the bottom piece 24 of the
enclosure.  The top piece 23 is made of thermally conductive
materials such as aluminum and the bottom piece 24 is made of
electrically insulating materials such as polymers or aluminum coated
with insulating materials.  The two pieces are then joined together
to fo an enclosure for the module.  Some reworkable adhesives are
used to seal the gaps left in the slots in the bottom piece 24.  A
piece of material 22 which has the thermal expansion coefficient
similar to the substrate 11 is epoxied or bonded to the inner surface
of the bottom piece 24 to control the thermal expansion mismatch.
The drawing in the circle of Fig. 1 shows the details of the solder
joins for connecting the strips to the substrate.  Each strip has a
polymer layer 33 and multiple metal lines 31 and 32 on its surfaces.
Solder fillets 34 and 35 are formed between the connection pad 15 on
the substrate 11 and the metal lines 31 and 32.

      Fig. 2 is the cross-sectional view of a single-chip module
using the same idea.  The flex strips 113 consist of metal lines 131
an...