Browse Prior Art Database

Heatsink Design Including Decoupling Condenser

IP.com Disclosure Number: IPCOM000106291D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Yamanaka, K: AUTHOR

Abstract

Disclosed is a design of heatsink for flip chip attached semiconductor. This heatsink includes a condenser structurally to reduce noises generated by semiconductor switching. Attaching this on a chip gives heatsink, electro static shielding and decoupling condenser functions at a time with low assembly profile.

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Heatsink Design Including Decoupling Condenser

      Disclosed is a design of heatsink for flip chip attached
semiconductor.  This heatsink includes a condenser structurally to
reduce noises generated by semiconductor switching.  Attaching this
on a chip gives heatsink, electro static shielding and decoupling
condenser functions at a time with low assembly profile.

      The Figure shows an typical design of this heatsink.  Two metal
plates sandwich a thin dielectric film to form a condenser and the
each metal plate extrudes plural number of leads from themselves to
be soldered to GND and Vdd on the printed circuit board.  This
decoupling condenser shows preferable performance owing to less lead
inductance and the metal body works as the electro static shielding
to improve EMI immunity.

      This heat sink can be easily attached to the top of flip chip
attached semiconductor with the adhesive or thermal conductive paste
as ordinal heatsink, and also the leads can be connected to the
soldering pads on the printed circuit board with paste solder.