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One-Piece Cap and Heatsink, Fabricated by Fin Lamination, for Electronic Modules

IP.com Disclosure Number: IPCOM000106326D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 4 page(s) / 114K

Publishing Venue

IBM

Related People

Ellsworth, MJ: AUTHOR [+4]

Abstract

The plate-fins 101 of a laminated heatsink are formed by conventional stamping methods from standard multi-gage strip 102. As in known laminated heat sinks, a portion of each plate comprises a fin 103 and has the desired fin thickness, while other portions 104, along the bottom and top edges of the plate, have a thickness equal to the sum of the fin thickness and the desired flow channel width. When several plate-fins are stacked front-to-back, the fin regions 103 lie between convectively cooled flow channels 405,506. Existing plate-fin lamination techniques, such as e-beam welding, brazing, and direct copper-to-copper bonding (gas-solid diffusion brazing), are used to join the plate-fins together. The laminated plate-fin heatsink may be installed as a unit that is separable from a capped multi-chip module.

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One-Piece Cap and Heatsink, Fabricated by Fin Lamination, for Electronic Modules

      The plate-fins 101 of a laminated heatsink are formed by
conventional stamping methods from standard multi-gage strip 102.  As
in known laminated heat sinks, a portion of each plate comprises a
fin 103 and has the desired fin thickness, while other portions 104,
along the bottom and top edges of the plate, have a thickness equal
to the sum of the fin thickness and the desired flow channel width.
When several plate-fins are stacked front-to-back, the fin regions
103 lie between convectively cooled flow channels 405,506.  Existing
plate-fin lamination techniques, such as e-beam welding, brazing, and
direct copper-to-copper bonding (gas-solid diffusion brazing), are
used to join the plate-fins together.
     The laminated plate-fin heatsink may be installed as a unit that
is separable from a capped multi-chip module.  Disclosed here,
however, is plate-fin assembly in which the cap is incorporated into
the laminate, yielding a one-piece cap and heat sink structure.
Clearance for elec- tronic components that protrude from the
substrate is provided by a notch that is formed in the base of the
plate-fins 202 as they are stamped.  A stack of plate-fins 202 having
one or more plate fins 201 on each end yields a laminated heatsink
301 having a base with the needed cavity to receive the protruding
electronic components 302.  A conductive grease or other thermal
compound 304 thermally conn...