Browse Prior Art Database

High Quality Permalloy Sputtering for the Fabrication of Inductive Heads

IP.com Disclosure Number: IPCOM000106327D
Original Publication Date: 1993-Oct-01
Included in the Prior Art Database: 2005-Mar-20
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Baratte, H: AUTHOR [+4]

Abstract

This article describes a process for decreasing the thermal stress developed in the critical pole tip P2 of inductive heads.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 97% of the total text.

High Quality Permalloy Sputtering for the Fabrication of Inductive Heads

      This article describes a process for decreasing the thermal
stress developed in the critical pole tip P2 of inductive heads.

      During the manufacture of an inductive magnetic head, the NiFe
permalloy is sputtered with a reduced pre-etch of the underlying hard
bake photoresist (I5).  The temperature during deposition is
decreased from 70degree C to 45degree C. In order to maintain the
same equilibrium of stress in the pole tip P2, the temperature of the
Al2O3 overcoat sputtering must be lowered by approximately the same
amount as the seed temperature.

      In a typical example, the Argon sputter etching was performed
using the following conditions:

o   Power       740 Watts
o   Pressure    1.3 x 10-2 mbar
o   DC          590 - 610 V (Target)

      The sputter etch time could be reduced from 14.5 min
(temperature 70degree C) to 3 min (temperature 45degree C).

      Subsequently, the target was pre-cleaned and the permalloy was
deposited with the following conditions:

o   Power       1760 Watts
o   Pressure    1.3 x 10-2 mbar
o   DC          300 V (Target)
o   Bias        -50 V (Substrate)

      The magnetic anisotropy Hk is increased from 5 Oe at 70degree C
to 6 Oe at 45degreeC, which is desirable for horizontal magnetic
domains orientation in the pole tip P2 of the head.

      The local orientation of...