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Oscillating Multiple Solder Wave Device

IP.com Disclosure Number: IPCOM000106379D
Original Publication Date: 1993-Nov-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Ma, WM: AUTHOR

Abstract

Disclosed is a device that can create multiple oscillating solder waves from a single solder flow. The solderability of a circuit board with plated thru holes (PTH) and surface mount devices (SMD) can be improved because of the self oscillating motion of the solder waves.

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This is the abbreviated version, containing approximately 75% of the total text.

Oscillating Multiple Solder Wave Device

      Disclosed is a device that can create multiple oscillating
solder waves from a single solder flow.  The solderability of a
circuit board with plated thru holes (PTH) and surface mount devices
(SMD) can be improved because of the self oscillating motion of the
solder waves.

      In the Figure, the device consists of a stainless steel plate
(1) with a thickness (2).  Two or more baffles (3) with radius (4)
are welded to the plate (1).  The plate (1) is then assembled to the
solder nozzle (5).  The thickness (2) of the plate (1) is designed
such that the flow of solder (6) over the baffles (3) will cause the
plate (1) to oscillate (7) up and down.  The oscillating solder waves
will create a turbulent flow at the solderable surfaces, thus
improving the wetting process.

      Inadequate solder contact with circuit board pads and plated
thru holes (PTH) results in non-wets and solder voids.  Contamination
on pads not being effectively removed by the flux and solder flow
pressure.

      This invention will increase the dynamics of the solder wave on
the circuit board thus promoting better wetting.

      Fabricate a flat plate with multiple parallel baffles to create
multiple waves.  The plate to be designed as a spring so that the
flow of the solder will cause it to oscillate up and down.  The plate
will be attached in front of the solder nozzle.  The compression of
the solder flow will be varied to cr...