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Temperature-Activated Flow Control Valve for Isothermal Modular Electronic Cooling System

IP.com Disclosure Number: IPCOM000106380D
Original Publication Date: 1993-Nov-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+4]

Abstract

Disclosed is a mechanical flow control valve (FCV) that regulates coolant discharge temperature from electronic circuit modules by increasing and decreasing the flow through the module in response to temperature fluctuations in the coolant discharge temperature. Flow through the FCV is determined by a balance of opposing forces. Fluid pressure and drag forces and a bellows act to push a suitable throttling valve open, while an opposing spring works to close the valve. The poppet comes to rest when the net force is zero, and the flow rate varies with the displacement of the poppet from its seat.

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This is the abbreviated version, containing approximately 55% of the total text.

Temperature-Activated Flow Control Valve for Isothermal Modular Electronic Cooling System

      Disclosed is a mechanical flow control valve (FCV) that
regulates coolant discharge temperature from electronic circuit
modules by increasing and decreasing the flow through the module in
response to temperature fluctuations in the coolant discharge
temperature.  Flow through the FCV is determined by a balance of
opposing forces.  Fluid pressure and drag forces and a bellows act to
push a suitable throttling valve open, while an opposing spring works
to close the valve.  The poppet comes to rest when the net force is
zero, and the flow rate varies with the displacement of the poppet
from its seat.

      The bellows is capped on both ends to form a hermetic
enclosure, and it is filled with a single component liquid-vapor
mixture.  The encapsulated fluid maintains the saturation pressure in
the bellows that corresponds to the temperature imposed by fluid
flowing through the valve and over the bellows.  In the case of a
water cooled electronics package, for example, the bellows might be
filled with a water/water vapor mixture.  As the temperature of the
fluid flowing through the valve increases, some of the liquid in the
bellows boils off, raising the pressure in the bellows and further
opening the valve.  As the valve opens, the opposing spring is
displaced until the forces acting on the stem are balanced.  Flow
through the module is thereby increased and the modul...