Browse Prior Art Database

Power and Encapsulant Supply from a Through Hole in A Card

IP.com Disclosure Number: IPCOM000106392D
Original Publication Date: 1993-Nov-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Kobayakawa, Y: AUTHOR [+4]

Abstract

This structure makes it possible to supply electrical power to a chip efficiently through a hole provided in a card and to supply viscous encapsulant through the same hole without void. This enables stable power supply with low inductance power line and good encapsulant flow comparing capirally action flow from chip edge.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Power and Encapsulant Supply from a Through Hole in A Card

      This structure makes it possible to supply electrical power to
a chip efficiently through a hole provided in a card and to supply
viscous encapsulant through the same hole without void.  This enables
stable power supply with low inductance power line and good
encapsulant flow comparing capirally action flow from chip edge.

      Fig. 1 shows the cross sectional illustration of this
structure.  A card (1) has a through hole (3) beneath a chip (2).
The power is supplied from the card to the chip through a power plane
(4) of the card, the through hole (3) and a chip bump (5).
Encapsulant (6) is also supplied from the through hole (3) even if
the viscosity is too high for capirally action only.

      In case of very high viscous encapsulant, the encapsulation can
be done with vacuum from the through hole (3) as shown in Fig. 2.