Browse Prior Art Database

Bent Leads of LSI Package (All Surface Mount Parts)

IP.com Disclosure Number: IPCOM000106452D
Original Publication Date: 1993-Nov-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Terada, M: AUTHOR

Abstract

Disclosed are Bent Leads of LSI Package which improve solderability and can be kept up from shock.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Bent Leads of LSI Package (All Surface Mount Parts)

      Disclosed are Bent Leads of LSI Package which improve
solderability and can be kept up from shock.

      Examples are shown in Fig. 1.  The leads Angle 'A' is defined
as 0 < A < 90.  Applying cream solder gather under the pointed end of
them, as shown in Figs. 2 and 3(1).  They use solder so far as solder
could be useful, i.e., as much as the heel when card through reflow
soldering machine as shown in Figs. 2 and 3(2).  A section of leads
does not have gilt.  However, the backs have gilt, therefore, solder
unites very well.  As a result, high retention force and improved
solderability can be obtained.