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Browse Prior Art Database

Device Mounting Method for Increased Packaging Density

IP.com Disclosure Number: IPCOM000106462D
Original Publication Date: 1993-Nov-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Urda, EJ: AUTHOR

Abstract

Disclosed is a method which permits the stacking of electronic components in such a manner that each device lead has its own mounting pad for soldering (thus avoiding direct lead to lead solder tying).

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Device Mounting Method for Increased Packaging Density

      Disclosed is a method which permits the stacking of electronic
components in such a manner that each device lead has its own
mounting pad for soldering (thus avoiding direct lead to lead solder
tying).

      Traditionally, component stacking on a circuit card assembly is
accomplished by soldering leads or terminals together.  This
traditional method can result in a less reliable, and potentially
unacceptable lead solder joint as compared to the disclosed method
which avoid lead tying.

      In the Figure, leaded components are stacked to provide
increased component packaging density.  Continuity from device lead
(1) to the printed circuit board (2) is obtained by means of a full
lead to pad solder joint, accomplished by designing in place
individual mounting pads (3) for each device lead.  The component
leads are formed down to their mounting pads, which allows for a
full, robust solder joint for each individual lead without lead
solder tying.