Browse Prior Art Database

New Conduction Cooling Approach for 3D Packages

IP.com Disclosure Number: IPCOM000106516D
Original Publication Date: 1993-Nov-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 4 page(s) / 95K

Publishing Venue

IBM

Related People

Anderson, TM: AUTHOR [+4]

Abstract

Described is a means for applying to packages originally designed for direct immersion cooling, the well-known techniques of conduction cooling, namely a TCM-like module. The package uses a modified oil-encapsulated TCM-like module as the basic building block. Inherent in the TCM approach are metal spring-loaded pistons pressed against the heat producing devices to provide a conduction path to the coolant.

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New Conduction Cooling Approach for 3D Packages

      Described is a means for applying to packages originally
designed for direct immersion cooling, the well-known techniques of
conduction cooling, namely a TCM-like module.  The package uses a
modified oil-encapsulated TCM-like module as the basic building
block.  Inherent in the TCM approach are metal spring-loaded pistons
pressed against the heat producing devices to provide a conduction
path to the coolant.

      The basic building block is shown in Fig. 1.  An integral
coldplate 1 is attached to a chip populated substrate 2.  The
coldplate has metallic pistons 3 positioned over each heat producing
device 4.  Coolant channels 5, typical of coldplates, are arranged to
provide optimum cooling capacity and are fed by a supply manifold
(not shown) and in turn feed a return manifold 6.  The intent is to
replace the direct immersion dielectric liquid for which the product
was designed with a conduction cooled approach by submerging the
components into an oil-filled bath.  Since the application requires
conduction cooling of an immersion-cooled design, the coldplate is
not hermetically sealed to the substrate.  Instead, a porous seal 7
is provided at the perimeter of the substrate.  The porous seal will
allow the free entry of a heat transfer enhancing media (typically
oil) into and out of the area between the chips and pistons, but will
not allow particles to enter.  This seal, along with the porous top
cover 8 will also allow the basic building block to be evacuated of
air and back-filled with o...