Browse Prior Art Database

Cold Plate for Electronic Module using Plate-Fin Laminates

IP.com Disclosure Number: IPCOM000106581D
Original Publication Date: 1993-Nov-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 6 page(s) / 170K

Publishing Venue

IBM

Related People

Ellsworth, MJ: AUTHOR [+3]

Abstract

Conventional cold plates for multi-chip electronic packages have made use of vertical flow channels to provide convective dissipation of heat. The need to reduce cold plate thermal resistance has lead to steady reductions in the channel width and pitch. The limits of conventional cost competitive manufacturing techniques, however, are now being reached.

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This is the abbreviated version, containing approximately 52% of the total text.

Cold Plate for Electronic Module using Plate-Fin Laminates

      Conventional cold plates for multi-chip electronic packages
have made use of vertical flow channels to provide convective
dissipation of heat.  The need to reduce cold plate thermal
resistance has lead to steady reductions in the channel width and
pitch.  The limits of conventional cost competitive manufacturing
techniques, however, are now being reached.

      Disclosed here is a liquid cooled cold plate having a plurality
of narrow vertical cooling channels that are formed by a plate-fin
lamination technique.  A stamping tool having footprint 101 (dashed
line) is used in a conventional stamping process to form plate-fins
201 from standard multigage stock material 102.  A channel 103,
having a depth equal to the desired width of coolant flow channels in
the cold plate, is formed along one face of the stock material.  The
thicker portions of the multigage strip 104 along the top and bottom
edges have a thickness equal to the desired channel-to-channel pitch
in the cold plate, while the thinner center portion 105 is the
thickness of the desired fin between flow channels.

      Plate-fins 201 are formed with several deep notches 202, and
wider corner cuts of the same depth 203, along one of the long edges
of the plate.  These notches penetrate through the first thicker
region and into the thinner region, reaching approximately to the
second thick region along the opposite edge.  The first and second
thick regions are conveniently called the cap 204 and base 205
respectively.  The thinner center region is the fin 206.  The deep
notches 202 separate rectangular tabs 207 which protrude from the
base 205, and each tab is comprised of a fin 206 and a cap 204.  A
wide shallow notch 208 is cut into the base 205 from the side of the
plate-fin opposite the deep notches 202.  The notch 208 spans at
least from the left-most to right-most tabs 207.

      When a number of plate-fins are stacked front-to-back to form a
plate fin laminate 301, the tabs 207 form flow channels 302 separated
by fins 303; notches 202 form trench-like wells 304,305 between
columns of cooling channels 306 for the supply 304 and discharge 305
of coolant.  Brackets 307 cap the ends of the plate-fin laminate.
The brackets 307 and plate-fins 301 together form a perimeter flange
308.  The broad shallow notch 208 in the base of each plate-fin forms
a pocket 309 in the base of the laminate to provide clearance for
electronic components.  As is known, secondary notches within 208 can
be imparted to create a "skylined" module cap to accommodate
component height variations, or to customize the device-to-heatsink
spacing. ...