Browse Prior Art Database

High Temperature Seed Layer Process to Fabricate Stable Inductive Heads

IP.com Disclosure Number: IPCOM000106600D
Original Publication Date: 1993-Nov-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Baratte, H: AUTHOR [+6]

Abstract

A process is described wherein the temperatures of deposition for the seed and overcoat layers during fabrication of inductive heads are matched.

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This is the abbreviated version, containing approximately 100% of the total text.

High Temperature Seed Layer Process to Fabricate Stable Inductive Heads

      A process is described wherein the temperatures of deposition
for the seed and overcoat layers during fabrication of inductive
heads are matched.

      The inductive heads read-back signal instability has been
tracked back to the pole tip P2 region.  Obviously, the permalloy
composition in P2 as well as the alumina overcoat stress play an
important role when considering instability of inductive heads.

      In order to reach the right stress equilibrium in the pole tip
P2 of the head, the temperature of the seed layer has to be matched
to that of the alumina overcoat deposition.  Thus, the temperature of
the seed layer must be increased from about 70degC to about 100degC.

      The magnetics of the seed layer (orientation, coercivity, field
anisotropy, magnetostriction) are second order parameters for the
fabrication of stable heads.

      A "cold seed layer" (e.g., 45degC instead of 70degC), although
it is beneficial for the magnetics of the permalloy seed and plate,
leads to fabricating instable heads.