Browse Prior Art Database

Solder Ball Connection Engineering Change/Wire Add Rework Concepts

IP.com Disclosure Number: IPCOM000106669D
Original Publication Date: 1993-Dec-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 4 page(s) / 101K

Publishing Venue

IBM

Related People

Covert, J: AUTHOR [+3]

Abstract

Solder Ball Connection (SBC) has limited Engineering Change (EC) and Wire Add capability. SBC is an alternative to a PIH (Pin In Hole) ceramic module that is attached via solder to PCBs (Printed Circuit Boards). The solder balls simply replace the pins on the substrate and are attached to the surface of the PCB rather than through the PTH (Plated Through Hole), made of copper. The solder balls result in increased electrical performance and printed circuit board wireability. This disclosure describes two concepts for EC/WIRE ADD REWORK of SBC modules.

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Solder Ball Connection Engineering Change/Wire Add Rework Concepts

      Solder Ball Connection (SBC) has limited Engineering Change
(EC) and Wire Add capability.  SBC is an alternative to a PIH (Pin In
Hole) ceramic module that is attached via solder to PCBs (Printed
Circuit Boards).  The solder balls simply replace the pins on the
substrate and are attached to the surface of the PCB rather than
through the PTH (Plated Through Hole), made of copper.  The solder
balls result in increased electrical performance and printed circuit
board wireability.  This disclosure describes two concepts for
EC/WIRE ADD REWORK of SBC modules.

      SBC had two types of attachment processes.  One is called
"Dogbone", which is a circular copper land on the external surface of
the PCB where the solder ball will be attached during assembly.  This
copper land is connected by a circuit line to an adjacent PTH.  The
adjacent PTH or "via" is used to escape the module site and wire to
other areas of the PCB.  From a top view of the PCB the copper lands
look like a "Dogbone" or "Dumbbell".

      The other type of process is called "Via in Pad", which uses a
conductive filling or plugging material to fill the "Via" or PTH in
the PCB.  In the "Via in Pad" (sometimes referred to as "Via on Pad"
or "SBC Plugged Vias") process, the solder ball is mounted directly
on the "Via" or PTH copper land.  The "Via in Pad" design allows
increased wiring in the module area over the "Dogbone" design due to
the elimination of the connecting circuit and adjacent mounting pad.
(Fig. 1)

      The concepts are as follows:  "Dogbone" - First the SBC Module
is removed from t...