Browse Prior Art Database

Socketed Package for Surface Mount Applications

IP.com Disclosure Number: IPCOM000106742D
Original Publication Date: 1993-Dec-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Gaudenzi, GJ: AUTHOR [+4]

Abstract

Disclosed is a method for removably attaching a circuit module within a socket housing mounted on a circuit board. The circuit module includes a number of conductive compliant elements extending from a mounting side. A heat sink clamps the circuit module in place within the socket housing, so that the compliant elements individually make electrical contact with conductive pads on the surface of the circuit board.

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Socketed Package for Surface

Mount

Applications

      Disclosed is a method for removably attaching a circuit module
within a socket housing mounted on a circuit board.  The circuit
module includes a number of conductive compliant elements extending
from a mounting side.  A heat sink clamps the circuit module in place
within the socket housing, so that the compliant elements
individually make electrical contact with conductive pads on the
surface of the circuit board.

      Figs. 1 and 2 are transverse cross-sectional views of alternate
versions for attaching a circuit module.

      In Fig. 1, a circuit module 10 includes a number of conductive
compliant elements 12, extending outward from a mounting surface 14,
which are individually connected to various circuits (not shown)
within the module 10.  Compliant elements 12, which may be, for
example, spring contacts in the form of the "pogo" pin contacts used
in circuit test applications, fuzz buttons, or dendrite contacts, are
preferably arranged in a square or rectangular pattern.

      A socket housing 16, mounted on a surface 18 of a circuit card
19 by means of attachment pins 20, includes internal surfaces 22,
which guide circuit module 10 into a location where compliant
elements 12 contact conductive pads 24 on card surface 18.
Conductive pads 24, which are arranged in a pattern corresponding to
that of elements 12, are electrically connected to various circuits
(not shown) within card 19.

     ...