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Browse Prior Art Database

Flex Interconnect of Multi-Chip Modules

IP.com Disclosure Number: IPCOM000106787D
Original Publication Date: 1993-Dec-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Peterson, JC: AUTHOR [+2]

Abstract

Interconnection of Multi-Chip Modules (MCM) is not easily accomplished. In general, the modules are placed on a PC board using some means, usually a connector. This means of connection adds inductance to the high frequency lines of the module, reducing performance levels.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 78% of the total text.

Flex Interconnect of Multi-Chip Modules

      Interconnection of Multi-Chip Modules (MCM) is not easily
accomplished.  In general, the modules are placed on a PC board using
some means, usually a connector.  This means of connection adds
inductance to the high frequency lines of the module, reducing
performance levels.

      This invention shows a methodology to connect these modules
together using high performance cables.  It can be understood by
examination of the Figs. 1-3.  In Fig. 1, a plurality of chips (4) is
shown attached to silicon carriers (6) and (2) using flip chip
technology.  A flex cable (1), which can contain several wiring
levels, is placed between the flex and the silicon carrier.  The
slots might not be necessary if the chips (4) are sufficiently thin.
The modules are provided with solder balls (8) which provide the
means of attachment of the modules to the surface metalization of the
flex.  These solder balls can be used to distribute power or provide
paths for electrical signals in either direction A or B on the cable,
or between modules.

      In addition, light emitting devices (9) may be imbedded into
the silicon carriers, and since carriers are used to distribute
electrical signals, these devices can be used to communicate with
strategically placed light receivers (3) placed on the opposite
carrier.  Holes (5) are placed in appropriate locations so as not to
block light signals.

      Fig. 2 shows a structure similar to t...