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Browse Prior Art Database

Optical Flex Interconnect to Multi-Chip Modules

IP.com Disclosure Number: IPCOM000106861D
Original Publication Date: 1993-Dec-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Peterson, JC: AUTHOR [+2]

Abstract

Interconnection of Multi-Chip Modules (MCM) is not easily accomplished. In general, the modules are placed on a PC board using some means, usually a connector. This means of connection adds inductance to the high-frequency lines of the module, reducing performance levels.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Optical Flex Interconnect to Multi-Chip Modules

      Interconnection of Multi-Chip Modules (MCM) is not easily
accomplished.  In general, the modules are placed on a PC board using
some means, usually a connector.  This means of connection adds
inductance to the high-frequency lines of the module, reducing
performance levels.

      This invention shows a methodology to connect these modules
together using high performance cables that have embedded within them
optical fibers capable of transmitting optical signals.

      The invention can be understood by examination of the Figure.
A plurality of chips (4) are shown attached to active MCM carriers
(6) and (2) using flip chip technology.  A flex cable (1) is placed
between the modules.  The modules are provided with solder balls (8)
which provide the means of attachment of the modules to the surface
metalization of the flex.  These solder balls can be used to
distribute power or provide paths for electrical signals in either
direction A or B on the cable, or between the modules.

      In addition to the multiple electrical layers on the flex,
optical fibers (9) can be embedded in flex which allows optical
transmittal of signals between modules located along the cable.
Light emitting devices (10) are designed into the silicon, whose
outputs are aligned to the fiber optic cable in the flex through a 45
degree prism (11) formed in the fiber and the self-aligning nature of
the flip chip attachment.