Browse Prior Art Database

Thermally Enhanced Three-Dimensional Flex Interconnect of Multi-Chip Modules

IP.com Disclosure Number: IPCOM000106887D
Original Publication Date: 1993-Dec-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Peterson, JC: AUTHOR [+2]

Abstract

The invention can be understood by examination of the Figs. 1 and 2.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Thermally Enhanced Three-Dimensional Flex Interconnect of Multi-Chip Modules

      The invention can be understood by examination of the Figs. 1
and 2.

      Fig. 1 shows a plurality of Multi-Chip Modules (MCMs) (2)
placed on a cable (1).  A combination of carriers may be used either
active or passive.  Additionally, optical fibers may or may not be
embedded in the cable.

      Fig. 2 shows the plurality of MCMs similar to that in Fig. 1
except that the cable is formed to as to provide a three-dimensional
structure.  Fig. 2 also shows thermal enhancement means (11) clamped
or otherwise placed between the MCMs (12) and (13) and between (14)
and (15) (To simplify drawings, the chips have been omitted).