Browse Prior Art Database

Uniform Force Distribution on the Substrate

IP.com Disclosure Number: IPCOM000106900D
Original Publication Date: 1992-Jan-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Bordt, HR: AUTHOR

Abstract

During lapping and polishing, the ram force must be uniformly distributed on the substrate at defined points, irrespective of the substrate's thickness and whether it is fully planar or wedge-shaped.

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Uniform Force Distribution on the Substrate

       During lapping and polishing, the ram force must be
uniformly distributed on the substrate at defined points,
irrespective of the substrate's thickness and whether it is fully
planar or wedge-shaped.

      To this end, the described method is used which operates as
follows:
      1.   The ram force of the machine is applied to piston 1; this
piston acts through a liquid 2 on pressure stem 3.
      2.   A defined number of pressure stems, e.g., four, at the
corners of the substrate adapt to the substrate thickness.
      3.   After adaptation of the stems, an air cushion 4 suiting
the process accommodates the remainder of the displaced liquid until
the ram force has been applied to all substrates (the machine being
suitable for as many as five substrates).
           The pressure of the air cushion is also important and must
suit the different ram forces.
      4.   Upon completion of the process and withdrawal of the ram
force, piston 1 and pressure stems 3 are returned to their original
position by springs 5.

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