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Browse Prior Art Database

Pluggable TAB Using Spring Contact Connector

IP.com Disclosure Number: IPCOM000106944D
Original Publication Date: 1992-Jan-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Funari, J: AUTHOR [+2]

Abstract

TAB modules as a packaging method for integrated chips has been somewhat limited due to the TAB characteristics of soldering parallel outer leads. This article describes a pluggable TAB module with array lead capability as an alternate TAB-to-board attach process.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 86% of the total text.

Pluggable TAB Using Spring Contact Connector

       TAB modules as a packaging method for integrated chips
has been somewhat limited due to the TAB characteristics of soldering
parallel outer leads.  This article describes a pluggable TAB module
with array lead capability as an alternate TAB-to-board attach
process.

      The TAB's circuitry is etched such that circuit lines
approximately 5 mils in width can be inserted into spring contact
connectors and be flanked by clearance slots to accommodate the tips
of the spring contact connectors (see the figure).

      The line should have a ground plane of the same metal thickness
on the opposite side so that the width of the line is about equal to
the thickness.  The lines are plated with 10 to 20 microinches of
nickel followed by 15 to 30 microinches of gold.  The plating wraps
around so that continuity is maintained from the circuit side to the
ground plane side. This will aid in guaranteeing electrical contact
to the spring contact connector.

      To attach the TAB to the spring contact connector, the TAB is
fixed to a quarter circle roller.  The tool is then rolled over the
spring contact connectors pushing the metal into the springs.  This
tool is also necessary to remove the TAB by reversing this procedure.

      This type of TAB has the following advantages:
a)   Field removal and replacing of modules, using field engineering
tools.
b)   Low pluggable force due to the tool geometry, all...