Browse Prior Art Database

Plastic Bag Carrier

IP.com Disclosure Number: IPCOM000107171D
Original Publication Date: 1992-Jan-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 73K

Publishing Venue

IBM

Related People

Leas, JM: AUTHOR

Abstract

Disclosed is apparatus and method for moving a high density integrated circuit wafer between process tools without an ultraclean room. Wafers move between process tools in pre-cleaned plastic bags, each bag with a set of three concentric seals around its neck. The three concentric seals prevent dust from entering the bag and permit the bag to be attached to a port on a process tool so that the wafer may transfer between processing tool and bag without contamination reaching the wafer.

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This is the abbreviated version, containing approximately 52% of the total text.

Plastic Bag Carrier

       Disclosed is apparatus and method for moving a high
density integrated circuit wafer between process tools without an
ultraclean room.  Wafers move between process tools in pre-cleaned
plastic bags, each bag with a set of three concentric seals around
its neck.  The three concentric seals prevent dust from entering the
bag and permit the bag to be attached to a port on a process tool
so that the wafer may transfer between processing tool and bag
without contamination reaching the wafer.

      The following is the method for moving the wafer between tools
using the plastic bag carrier:
      1. A clean wafer carrying plastic bag with three concentric
adhesive seals is sealed to the edges of the tool port using the
outermost bag seal.
      2. A flow of clean nitrogen from the tool exhausts dust from
the small space between the first and second seal, said space having
been exposed to the external environment during the sealing process.
The space may be pumped down alternately with the nitrogen flow for
improved purging.
      3. The tool port opens.
      4. The two inner seals are opened.  Clean nitrogen inflates the
bag.  The wafer moves from tool to bag.  In passing through the neck
of the bag the wafer must not come in contact with the adhesive
films.
      5. The tool port closes.  The bag may be pumped down before it
is resealed at the two inner seals.  However, if the bag remains
inflated, it is possible to pick up the wafer from its bottom surface
and prevent the front surface of the wafer from touching the bag.
      6. The bag is peeled off the tool.
      7. The bagged wafer is carried to the next tool where it is
sealed to the port using the second seal.
      8. A flow of clean nitrogen exhausts dust from the small space
between the second and third seal, said...