Browse Prior Art Database

Localized Cleaner/ Process for Electronic Card Assembly

IP.com Disclosure Number: IPCOM000107207D
Original Publication Date: 1992-Jan-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 1 page(s) / 42K

Publishing Venue

IBM

Related People

Bonnell, RE: AUTHOR [+2]

Abstract

Disclosed is a tool/process for locally cleaning individual component locations on electronic circuit card assemblies. The tool/process (see figure below) consists of a spray nozzle suspended inside of an air nozzle which is nested inside of a vacuum housing. This cleaning head will be set in a fixture which uses an x-y table to locate the card manually over the location to be cleaned and a two-sided press to provide z axis movement to enable a water-tight seal of the cleaning tool gasket to the card without excessive card stresses. The press incorporates a vacuum sensor to indicate a proper seal before DI water can be supplied. DI water impinges upon a localized region of the card, defined by the total size of the housing (either top side, bottom side or both).

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Localized Cleaner/ Process for Electronic Card Assembly

      Disclosed is a tool/process for locally cleaning individual
component locations on electronic circuit card assemblies. The
tool/process (see figure below) consists of a spray nozzle suspended
inside of an air nozzle which is nested inside of a vacuum housing.
This cleaning head will be set in a fixture which uses an x-y table
to locate the card manually over the location to be cleaned and a
two-sided press to provide z axis movement to enable a water-tight
seal of the cleaning tool gasket to the card without excessive card
stresses.  The press incorporates a vacuum sensor to indicate a
proper seal before DI water can be supplied.  DI water impinges upon
a localized region of the card, defined by the total size of the
housing (either top side, bottom side or both).  The water will be
removed via the vacuum housing and will go to drain.  When the water
cleaning cycle completes, the DI water supply is shut off and warm
air circulated across the surface of the card to dry the card.  Over
spray will be limited by a gasket seal between the vacuum housing and
the card.  Each type of component will have an individual head
assembly defined for its specific module to module clearances.

      Disclosed anonymously.