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Browse Prior Art Database

Solder Ball Connection (SBC) Co-planarity With X-ray Technology

IP.com Disclosure Number: IPCOM000107211D
Original Publication Date: 1992-Jan-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 1 page(s) / 47K

Publishing Venue

IBM

Related People

Hoebener, K: AUTHOR [+2]

Abstract

If the co-planarity of solder balls exceeds the specified value, a degraded solder joint or open will be formed. This method provides the means of a quick GO/NO-GO check for co-planarity and ensures that only the good modules will be used for assembly.

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Solder Ball Connection (SBC) Co-planarity With X-ray Technology

      If the co-planarity of solder balls exceeds the specified
value, a degraded solder joint or open will be formed.  This method
provides the means of a quick GO/NO-GO check for co-planarity and
ensures that only the good modules will be used for assembly.

      This disclosed method uses x-ray technology such as
Laminography.  First the module is placed on a flat (pre-lapped)
surface.  The x-ray machine will create an X-Y plane (laminography
technology) at the spec limit above the flat surface (fig. 2).  If,
at any location, there is no solder ball shown on X-Y plane, the
module is out of spec. This method serves as a GO/NO-GO gauge to
accept or reject the module.

      Disclosed anonymously.