Browse Prior Art Database

Plastic Pin Grid Array Module Using TAB

IP.com Disclosure Number: IPCOM000107221D
Original Publication Date: 1992-Jan-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 1 page(s) / 46K

Publishing Venue

IBM

Related People

Karjnyak, RJ: AUTHOR

Abstract

Disclosed is a plastic pin grid array (PGA) package (see attached figure) constructed from epoxy glass printed circuit board (PCB) material 1 having stacked pins 2 and a ground plane 3 located near the surface. The integrated circuit (IC) chip 4 is attached to the PGA using tape automated bonding (TAB) 5 & 6. The TAB has standard inner leads for chip to lead connections 7 and fans out to vias which fit over the stacked pins 2.

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Plastic Pin Grid Array Module Using TAB

      Disclosed is a plastic pin grid array (PGA) package (see
attached figure) constructed from epoxy glass printed circuit board
(PCB) material 1 having stacked pins 2 and a ground plane 3 located
near the surface.  The integrated circuit (IC) chip 4 is attached to
the PGA using tape automated bonding (TAB) 5 & 6.  The TAB has
standard inner leads for chip to lead connections 7 and fans out to
vias which fit over the stacked pins 2.

      The PGA is constructed from epoxy glass printed circuit board
material 1.  The PCB has plated thru holes 8 into which stacked pins
2 are inserted.  The stacked pins are on either 100, staggered 100 or
50 mil grid.  A ground plane 3 is located near the upper surface of
the PGA.

      The TAB has standard copper inner leads for bonding to the chip
4.  The circuitry 5 would fan out from the inner pads to outer pads.
The outer pads would have been prepunched prior to etching the
circuitry.

      The TAB would be placed on the PGA so that the outer pads fit
over the stacked pins 2. An adhesive sheet 10 can be applied to the
PGA prior to the attachment of the TAB for maintaining proper
distance to the PGA and retention. Solder 9 is applied to the top of
the pins and reflowed in an oven to make the connection between the
TAB and PCB. Standard glob top material 11 is applied to the chip and
surrounding areas for protection.

      Disclosed anonymously.