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Browse Prior Art Database

Optical Subassembly Strain Relief

IP.com Disclosure Number: IPCOM000107225D
Original Publication Date: 1992-Jan-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 1 page(s) / 39K

Publishing Venue

IBM

Related People

McCabe, JF, III: AUTHOR

Abstract

Disclosed is a device to relieve strain on the pin leads of the TO-18 package mounted in an OSA (optical subassembly). By relieving the strain the leads may be inserted into a socket and powered up for testing. When this is done, through the use of the strain relief, the glass seal on two (2) of the three (3) leads will not be damaged.

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Optical Subassembly Strain Relief

      Disclosed is a device to relieve strain on the pin leads of the
TO-18 package mounted in an OSA (optical subassembly). By relieving
the strain the leads may be inserted into a socket and powered up for
testing.  When this is done, through the use of the strain relief,
the glass seal on two (2) of the three (3) leads will not be damaged.

      To install the strain relief the upper and lower body halves
must be oriented with the OSA and the leads, with the counterbore
seated on the body of the OSA.  By sliding the sleeve over the leads
and onto the two (2) body halves, the leads become anchored and may
be inserted into a socket without damage to the glass seals.

      After testing is complete and the leads are removed from the
socket, by continuing to move the sleeve in the same direction the
three (3) pieces of the strain relief may be disassembled without
placing any force on the leads that would cause damage.

      Disclosed anonymously.