Browse Prior Art Database

Stabilized Long Wire Bonding Technique

IP.com Disclosure Number: IPCOM000107226D
Original Publication Date: 1992-Jan-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 1 page(s) / 51K

Publishing Venue

IBM

Related People

Carden, GR: AUTHOR [+4]

Abstract

Disclosed is an automatic wire bonding technique for extending wire runs using adhesive stabilizer supports.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 83% of the total text.

Stabilized Long Wire Bonding Technique

      Disclosed is an automatic wire bonding technique for extending
wire runs using adhesive stabilizer supports.

      Prior fine wire run lengths were limited to a 100 x wire
diameter range for thermosonic, thermocompression or ultrasonic bond
integrated circuit interconnections.  Longer run lengths up to 280 x
the wire diameter range require precise, repeatable bonder control
with manufacturing process losses and highly susceptible to shock
and/or vibration damage.

      Two-sided adhesive tape wire stabilizers spaced at 100 x wire
diameters or less reduce unsupported wire runs between bond sites.
Pressure or heat-sensitive tape is applied to any convenient surface
such as edges of devices, pin heads, capacitors, resistors, etc.  The
components now become converted into stabilized adhesive tape
standoffs, placed at strategic sites as support for the longer wire
lengths.

      A special programmed automatic wire bonder completes initial or
first bond followed by unique wire looping with the wire feed control
contacting the stabilizing sites, and continues on to the second or
termination bond site. Looping profile indexes the bonding tool
beyond each of the stabilizing surfaces, the bonding tool then
lowers, causing the wire to contact the adhesive.  The wire feed
controls the wire drag through the bond tool for uniform
wire-adhesive wetting.  Looping profile and feed control sequence
continues until terminatio...