Browse Prior Art Database

Dimensional Control of Plated Wiring Board Surface Solder Deposits

IP.com Disclosure Number: IPCOM000107229D
Original Publication Date: 1992-Jan-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 1 page(s) / 31K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+3]

Abstract

Dimensional control of plated wiring board surface solder deposits can be achieved by mechanical shaving of the board with the use of a metal template. Use of this process can control solder height, solder volume, eliminate rounded deposits and produce coplanarity between pads.

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Dimensional Control of Plated Wiring Board Surface Solder Deposits

      Dimensional control of plated wiring board surface solder
deposits can be achieved by mechanical shaving of the board with the
use of a metal template.  Use of this process can control solder
height, solder volume, eliminate rounded deposits and produce
coplanarity between pads.

      In the figure, the solder deposits 1 can be dimensionally
controlled by first applying a metal template 2 to the board 3 with
either mechanical or removable adhesive fastening 4.  Blade 5 is then
passed across the template removing excess solder 6 as controlled by
the template thickness.  The resulting deposit 7 will be consistent
in height, volume and coplanarity with the other deposits covered by
the template.

      Disclosed anonymously.