Browse Prior Art Database

Decal Pattern Transfer by Ultrasonic/ Thermocompression Bonding

IP.com Disclosure Number: IPCOM000107242D
Original Publication Date: 1992-Jan-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 1 page(s) / 50K

Publishing Venue

IBM

Related People

Furman, BK: AUTHOR [+3]

Abstract

Disclosed is a technique for lithographically defining metal patterns on polymer films and then transferring them onto substrates individually or in large arrays, using ultrasonic or thermocompression bonding. In all cases the metal patterns fabricated can be tested on the support structure, thus allowing the elimination of electrically unacceptable sublaminates. This will enhance the yield of the joined assemblies made using only the good decal layers.

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Decal Pattern Transfer by Ultrasonic/ Thermocompression Bonding

      Disclosed is a technique for lithographically defining metal
patterns on polymer films and then transferring them onto substrates
individually or in large arrays, using ultrasonic or
thermocompression bonding.  In all cases the metal patterns
fabricated can be tested on the support structure, thus allowing the
elimination of electrically unacceptable sublaminates.  This will
enhance the yield of the joined assemblies made using only the good
decal layers.

      Figure 1 shows a process description for decal patterning.  In
the single layer metal decal one starts with a polymer carrier (such
as duPont's Kapton) stretched on a frame and coats a release layer.
The release layer can be metallic (such as sputtered or evaporated Cu
or Au) in cases where the pattern needs to have a conducting or
bondable top layer.  In this case, the release layer can also be used
as the seed layer for plating up the pattern.  In the cases where an
insulating layer is desired on top of the transferred pattern one can
coat a polymeric release layer (such as photosensitive or regular
polyimide) that will have an adhesion to the carrier polymer that is
less than the adhesion of the seed metal to the release polymer.
Once the seed layer is applied, the desired pattern is generated on a
suitable photoresist layer (such as duPont's Riston) coated or
laminated to the seed layer.  The pattern is then electroplated,
resist...