Browse Prior Art Database

Reusable Decal Design for Solder Decal Transfer Technique

IP.com Disclosure Number: IPCOM000107266D
Original Publication Date: 1992-Feb-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Imken, RL: AUTHOR

Abstract

This invention proposes a design for decals and a plating fixture which allows decals to be reused and eliminates the process of decal excising.

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This is the abbreviated version, containing approximately 100% of the total text.

Reusable Decal Design for Solder Decal Transfer Technique

       This invention proposes a design for decals and a plating
fixture which allows decals to be reused and eliminates the process
of decal excising.

      In this invention, decals are fabricated as shown in Fig. 1.
The surface for plating is made slightly larger than the desired
solder pattern.  A location stud on the back side provides for
positioning in the plating fixture (Fig. 2) and establishes
electrical contact between the metal decal and fixture (which is also
conductive). Although the location stud and corresponding fixture
opening are shown as rectangular, the shape could be optimized for
ease of fabrication and function (e.g., circular).

      Once decals are fabricated and surface finished, they are
inserted into the plating fixture.  The result is shown in Fig. 3.
Plated decals are then removed from the plating fixture by pressing
on the location stud from the backside of the fixture.

      This invention is best suited for large solder decals (10 mm or
greater in the smallest dimension) where the yield of decals per
panel would be low and the ease of fabricating decals with location
studs easiest. Decals can be reused so that there is a one-time
substrate preparation cost. Handling of decals after preparation is
facilitated.  In addition, the location stud can provide a grippable
feature for handling and placement operations.