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Process to Eliminate the Thin Gold from the Legs of the Read Track on an Interleaved Tape Head with Deposited Magnetic Shields

IP.com Disclosure Number: IPCOM000107434D
Original Publication Date: 1992-Feb-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Denison, EV: AUTHOR [+3]

Abstract

A problem has been observed when a conductive shield material A (see Fig. 1) is under the read track of an interleaved magnetic tape head because the MR B and thin gold legs C are insulated from the shield material by I-1 insulator D gap material (Al2O3, SiO2, etc.) which is under 3000 angstroms thick. Because the substrate is rough, the insulator will not totally insulate the conductive shield material from the MR or thin gold legs, and shorting can occur which is detrimental to the read track magnetic performance.

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Process to Eliminate the Thin Gold from the Legs of the Read Track on an Interleaved Tape Head with Deposited Magnetic Shields

       A problem has been observed when a conductive shield
material A (see Fig. 1) is under the read track of an interleaved
magnetic tape head because the MR B and thin gold legs C are
insulated from the shield material by I-1 insulator D gap material
(Al2O3, SiO2, etc.) which is under 3000 angstroms thick.  Because the
substrate is rough, the insulator will not totally insulate the
conductive shield material from the MR or thin gold legs, and
shorting can occur which is detrimental to the read track magnetic
performance.

      This problem can be reduced by eliminating the thin gold and
depositing the I-2 insulator gap material about 3000 angstroms thick
of the same material as the I-1 E (Fig. 2) by using a mask lift-off
technique and opening a window on the pad of the MR so the thick gold
F can be deposited and allowed to connect to the MR material. This
method of fabrication allows the gold read leg to be twice the
distance from the conductive shield and reduce the risk of shorts.
This process also eliminates a photolithgraphy masking and film
deposition step.