Browse Prior Art Database

Ladder Pattern for Soldering Circuit Board Ground Pads

IP.com Disclosure Number: IPCOM000107445D
Original Publication Date: 1992-Feb-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 1 page(s) / 104K

Publishing Venue

IBM

Related People

Bucher, DJ: AUTHOR [+2]

Abstract

Disclosed is a pattern used for even application of solder on a printed circuit board ground pad. The pattern provides an adequate surface area for grounding of the printed circuit board while controlling the solder height and solder height variance.

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This is the abbreviated version, containing approximately 100% of the total text.

Ladder Pattern for Soldering Circuit Board Ground Pads

      Disclosed is a pattern used for even application of solder on a
printed circuit board ground pad.  The pattern provides an adequate
surface area for grounding of the printed circuit board while
controlling the solder height and solder height variance.

      The pattern (see Figure 1) is defined on the ground pad by the
application of solder mask.  (Ground pad, as used here, is an area of
copper on the circuit board that provides a connection from board to
box ground by being in direct contact with part of the box frame).
The pattern, when oriented parallel to the direction of travel in the
wave solder, provides a solderable surface which allows an even
application of solder.  The pattern also provides adequate surface
area to maintain good ground contact between the board and the box.
The pattern is capable of maintaining a solder height less than
.010".

      Disclosed anonymously.