Browse Prior Art Database

Field Correction Plate

IP.com Disclosure Number: IPCOM000107478D
Original Publication Date: 1992-Feb-01
Included in the Prior Art Database: 2005-Mar-21
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Fugardi, JF: AUTHOR [+2]

Abstract

Disclosed is a method for eliminating metal backscatter and redeposition products when RF etch is used as an in-situ sputter clean process on dielectric substrates.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Field Correction Plate

      Disclosed is a method for eliminating metal backscatter and
redeposition products when RF etch is used as an in-situ sputter
clean process on dielectric substrates.

      In the metal evaporation process for glass/ceramic substrates,
an RF sputter etch step cleans the product surface prior to
deposition of metals.  When thin dielectric substrates are processed,
a redeposit forms around the perimeter of the substrate and a uniform
coating of metal backscatters over the entire surface.

      Placing a metal plate on the back side of the substrate (see
figure) reduces both backscatter and redeposit to a negligible,
non-conductive, reproducible level.  The added metal plate in contact
with the tooling and the dome aids in producing a uniform electric
field.

      Disclosed anonymously.